P-class series

Reduce inspection costs by implementing a pre-shipment
final vision inspection system

System Features

  • High resolution: Solder mask inspection using high resolution color CCD camera
  • Fast scanning: 13-18.5 sec/strip (dual scanning) high speed inspection
  • High accuracy: Inspection using algorithms designed for minute defects
  • Multiple functions: Multiple cameras inspect each portion of the product

Detailed Equipment Specifications

System Handling

  • Top & Bottom double-side auto reverse inspection
  • Strip format: 120-270(L) x 25-70(W) mm
  • Stack length: 500 strips/200mm
  • Pick & Place transfer/index table
  • Auto-sorting of good and defective products
  • Stage with Clean Roller to remove foreign material (Option)

System Functions

  • Dual camera (7.5k 8bit Color CCD or 8k 12bit B/W CCD)
  • Resolution settings: 2.4-8um/pixel (manual)
  • Strip format: 25-270(L) x 25-70(W) mm
  • Dual CPU & Multi DSP image processing system
  • Auto-focus and software auto-calibration unit
  • PC base control host
  • Continuous inspection made possible with parallel processing
  • High intensity white light source
  • Create inspection area with CAD Link (Option)
  • Re-check defect data with verification station

Inspection Functions

  • Contamination, discoloration, nodule, dent, scratch, exposed Ni, unplating, pinhole, foreign material, disconnection, short circuit, chipping, bump
  • SR peeling, irregularities, contamination, unplating, foreign material on SR, foreign material in SR, unfilled through hole, delamination, SR convexity

Inspection Items

  • Bonding pad, power ring, ball pad, FC pad, solder mask


  • SIZE: 1,800 (L) x 1,060 (W) x 1,800 (H) mm