Reduce inspection costs by implementing a pre-shipment final vision inspection system
System Features
- High resolution: Solder mask inspection using
high resolution color CCD camera - Fast scanning: 2.0 sec/unit (dual surface inspection) high speed inspection
- High accuracy: Inspection using algorithms designed
for minute defects - Multiple functions: Multiple cameras inspect each portion
of the product
Detailed Equipment Specifications
System Handling
- Top & Bottom double-side auto reverse inspection
- Product sizes: 15x15mm – 70x70mm
- JEDEC Tray maximum load: 300mm/30 Trays or more
- Pick & Press index table type
- Auto-sorting of good and defective products
- Foreign material removal stage (Option)
System Functions
- Dual camera (7.5k 8bit Color CCD or 8k 12bit B/W
CCD) - Resolution settings: 2.4-8um/pixel (manual)
- Inspection area: 15x15mm – 70x70mm
- Dual CPU & Multi DSP image processing system
- Auto-focus and software auto-calibration unit
- PC base control host
- Continuous inspection made possible with parallel processing
- High intensity white light source
- Create inspection area with CAD Link (Option)
- Re-check defect data with verification station
Inspection Functions
- Contamination, discoloration, nodule, dent, scratch, exposed Ni, unplating, pinhole, foreign material, disconnection, short circuit, bump scratch, bump
- SR peeling, irregularities, contamination, unplating, foreign material on SR, foreign material in SR, unfilled through hole, delamination, SR convexity
Inspection Items
- Bump, solder ball, CC pad, ball pad, FC pad (no-bump product), solder mask
Dimensions
- SIZE: 2,000 (L) x 1,400 (W) x 1,900 (H) mm