FC series

Reduce inspection costs by implementing a pre-shipment final vision inspection system

System Features

  • High resolution: Solder mask inspection using
    high resolution color CCD camera
  • Fast scanning: 2.0 sec/unit (dual surface inspection) high speed inspection
  • High accuracy: Inspection using algorithms designed
    for minute defects
  • Multiple functions: Multiple cameras inspect each portion
    of the product

Detailed Equipment Specifications

System Handling

  • Top & Bottom double-side auto reverse inspection
  • Product sizes: 15x15mm – 70x70mm
  • JEDEC Tray maximum load: 300mm/30 Trays or more
  • Pick & Press index table type
  • Auto-sorting of good and defective products
  • Foreign material removal stage (Option)

System Functions

  • Dual camera (7.5k 8bit Color CCD or 8k 12bit B/W
  • Resolution settings: 2.4-8um/pixel (manual)
  • Inspection area: 15x15mm – 70x70mm
  • Dual CPU & Multi DSP image processing system
  • Auto-focus and software auto-calibration unit
  • PC base control host
  • Continuous inspection made possible with parallel processing
  • High intensity white light source
  • Create inspection area with CAD Link (Option)
  • Re-check defect data with verification station

Inspection Functions

  • Contamination, discoloration, nodule, dent, scratch, exposed Ni, unplating, pinhole, foreign material, disconnection, short circuit, bump scratch, bump
  • SR peeling, irregularities, contamination, unplating, foreign material on SR, foreign material in SR, unfilled through hole, delamination, SR convexity

Inspection Items

  • Bump, solder ball, CC pad, ball pad, FC pad (no-bump product), solder mask


  • SIZE: 2,000 (L) x 1,400 (W) x 1,900 (H) mm