Reduce inspection costs by implementing a pre-shipment final vision inspection system
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System Features |
- High resolution: Solder mask inspection using
high resolution color CCD camera
- Fast scanning: 2.0
sec/unit (dual surface inspection) high speed inspection
- High accuracy: Inspection using algorithms designed
for minute defects
- Multiple
functions: Multiple cameras inspect each portion
of the product
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Detailed Equipment Specifications |
System Handling
- Top & Bottom double-side auto reverse inspection
- Product
sizes: 15x15mm – 70x70mm
- JEDEC Tray maximum
load: 300mm/30 Trays or more
- Pick & Press index
table type
- Auto-sorting of good and defective products
- Foreign
material removal stage (Option)
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System Functions
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Dual camera (7.5k 8bit Color CCD or 8k 12bit B/W
CCD)
- Resolution settings: 2.4-8um/pixel (manual)
- Inspection
area: 15x15mm – 70x70mm
- Dual CPU & Multi
DSP image processing system
- Auto-focus and software
auto-calibration unit
- PC base control host
- Continuous inspection made possible
with parallel processing
- High intensity white light
source
- Create inspection area with CAD Link (Option)
- Re-check
defect data with verification station
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Inspection
Functions
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Contamination, discoloration, nodule, dent, scratch,
exposed Ni, unplating, pinhole, foreign material,
disconnection, short circuit, bump scratch, bump
- SR
peeling, irregularities, contamination, unplating,
foreign material on SR, foreign material
in SR, unfilled
through hole, delamination, SR convexity
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Inspection Items
- Bump, solder ball, CC pad, ball pad, FC pad (no-bump
product), solder mask
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Dimensions
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SIZE: 2,000 (L) x 1,400 (W) x 1,900 (H) mm
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