Reduce inspection costs by implementing a pre-shipment final vision inspection system

System Features

• High resolution: Solder mask inspection using high resolution color line CCD camera
• Fast scanning: 70m/hour high speed inspection
• High accuracy: Inspection using algorithms designed for minute defects
• Multiple functions: Multiple cameras inspect each portion of the product

Detailed Equipment Specifications

System Handling

• High speed handling with tension control unit
• Anti-static electricity unit reduces buildup of foreign material
• Punching unit with X-Y table
• Shaft diameter: 25.4mm
• Reel diameter: Max. 650mm
• Tape width: 35mm, 48mm, 105mm (systems compatible with tape widths greater than 105mm under development)
• Board thickness: Min. 25um

Processing System

• Dual camera (7.5k 8bit Color CCD or 8k 12bit B/W CCD)
• Resolution settings: 2.4-8um/pixel (manual)
• Dual CPU & Multi DSP image processing system
• PC base control host
• Continuous inspection made possible with parallel processing
• Create inspection area with CAD Link (Option)
• Re-check defect data with verification station

Dimensions

• SIZE: 825 (L) x 1,200 (W) x 890 (H) mm

Exterior Photograph of Defect Detection Mode