Reduce inspection costs by implementing a pre-shipment final vision inspection system

System Features

• High resolution: Solder mask inspection using high resolution color CCD camera
• Fast scanning: 13-18.5 sec/strip (dual scanning) high speed inspection
• High accuracy: Inspection using algorithms designed for minute defects
• Multiple functions: Multiple cameras inspect each portion of the product

Detailed Equipment Specifications

System Handling

• Top & Bottom double-side auto reverse inspection
• Strip format: 120-270(L) x 25-70(W) mm
• Stack length: 500 strips/200mm
• Pick & Place transfer/index table
• Auto-sorting of good and defective products
• Stage with Clean Roller to remove foreign material (Option)

System Functions

• Dual camera (7.5k 8bit Color CCD or 8k 12bit B/W CCD)
• Resolution settings: 2.4-8um/pixel (manual)
• Strip format: 25-270(L) x 25-70(W) mm
• Dual CPU & Multi DSP image processing system
• Auto-focus and software auto-calibration unit
• PC base control host
• Continuous inspection made possible with parallel processing
• High intensity white light source
• Create inspection area with CAD Link (Option)
• Re-check defect data with verification station

Inspection Functions

• Contamination, discoloration, nodule, dent, scratch, exposed Ni, unplating, pinhole, foreign material, disconnection, short circuit, chipping, bump
• SR peeling, irregularities, contamination, unplating, foreign material on SR, foreign material in SR, unfilled through hole, delamination, SR convexity

Inspection Items

• Bonding pad, power ring, ball pad, FC pad, solder mask

Dimensions

• SIZE: 1,800 (L) x 1,060 (W) x 1,800 (H) mm