Reduce inspection
costs by implementing a pre-shipment final vision inspection system |
| Inspection for PBGA/SIP/CSP |
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- High resolution: Solder mask inspection using
high resolution color CCD camera
- Fast scanning: 13-18.5 sec/strip (dual scanning)
high speed inspection
- High accuracy: Inspection using algorithms designed
for minute defects
- Multiple functions: Multiple cameras inspect each
portion of the product
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| Inspection for Flip Chip / Cavity Down |
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- High resolution: Solder mask inspection using
high resolution color CCD camera
- Fast scanning: 2.0 sec/unit (dual surface inspection)
high speed inspection
- High accuracy: Inspection using algorithms designed
for minute defects
- Multiple functions: Multiple cameras inspect
each portion of the product
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| Reel type final vision inspection system
COF,TAB... |
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- High resolution: Solder mask inspection using
high resolution color line CCD camera
- Fast scanning: 70m/hour high speed inspection
- High accuracy: Inspection using algorithms designed
for minute defects
- Multiple functions: Multiple cameras inspect each
portion of the product
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Perform pinpoint inspection for after-inspection review
to prevent defects from getting sent to the next process |
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- High resolution: High precision positioning with
precise stage movements
- Operability: Semi-automatic movement reduces inspector
material handling loss
- Data transfer: Connect to equipment through LAN
for smooth data access
- Multiple functions: User may select between microscope
inspection and monitor inspection
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