UTECHZONE

UTECHZONE CO.,LTD.

Reduce inspection costs by implementing a pre-shipment final vision
inspection system

Inspection for PBGA/SIP/CSP

  • High resolution: Solder mask inspection using high resolution color CCD camera
  • Fast scanning: 13-18.5 sec/strip (dual scanning) high speed inspection
  • High accuracy: Inspection using algorithms designed for minute defects
  • Multiple functions: Multiple cameras inspect each portion of the product

Inspection for Flip Chip / Cavity Down

  • High resolution: Solder mask inspection using high resolution color CCD camera
  • Fast scanning: 2.0 sec/unit (dual surface inspection) high speed inspection
  • High accuracy: Inspection using algorithms designed for minute defects
  • Multiple functions: Multiple cameras inspect each portion of the product

Reel type final vision inspection system COF,TAB…

  • High resolution: Solder mask inspection using high resolution color line CCD camera
  • Fast scanning: 70m/hour high speed inspection
  • High accuracy: Inspection using algorithms designed for minute defects
  • Multiple functions: Multiple cameras inspect each portion of the product

Perform pinpoint inspection for after-inspection review
to prevent defects from getting sent to the next process

  • High resolution: High precision positioning with precise stage movements
  • Operability: Semi-automatic movement reduces inspector material handling loss
  • Data transfer: Connect to equipment through LAN for smooth data access
  • Multiple functions: User may select between microscope inspection and monitor inspection