Precision apparatus special trading company
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UTECHZONE CO.,LTD.

Reduce inspection costs by implementing a pre-shipment final vision inspection system

Inspection for PBGA/SIP/CSP  
  • High resolution: Solder mask inspection using high resolution color CCD camera
  • Fast scanning: 13-18.5 sec/strip (dual scanning) high speed inspection
  • High accuracy: Inspection using algorithms designed for minute defects
  • Multiple functions: Multiple cameras inspect each portion of the product
 
Inspection for Flip Chip / Cavity Down  
  • High resolution: Solder mask inspection using high resolution color CCD camera
  • Fast scanning: 2.0 sec/unit (dual surface inspection) high speed inspection
  • High accuracy: Inspection using algorithms designed for minute defects
  • Multiple functions: Multiple cameras inspect each portion of the product
 
Reel type final vision inspection system COF,TAB...  
  • High resolution: Solder mask inspection using high resolution color line CCD camera
  • Fast scanning: 70m/hour high speed inspection
  • High accuracy: Inspection using algorithms designed for minute defects
  • Multiple functions: Multiple cameras inspect each portion of the product
 

Perform pinpoint inspection for after-inspection review to prevent defects from getting sent to the next process

  • High resolution: High precision positioning with precise stage movements
  • Operability: Semi-automatic movement reduces inspector material handling loss
  • Data transfer: Connect to equipment through LAN for smooth data access
  • Multiple functions: User may select between microscope inspection and monitor inspection




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